Calculation of automatic SMD mounting cost
The cost of automatic SMD mounting depends on the quality of boards of the same type, complexity and terms of work. In case you send us the layout chart and specifications in any form you can get preliminary estimate of an order. On the basis of your data we form preliminary estimate of order cost and terms.
TECHNOLOGICAL REQUIREMENTS TO ORDERS ON SMD MOUNTING (AUTOMATIC LINE)
1. Dimensions of a printed circuit board (PCB) or a group printed circuit board must be in the following range: 460 õ 460(330) mm — maximum size and 50 õ 50 mm — minimum size;
2. The components must be not closer than 3 mm from the edge of a printed circuit board. Technological fields 3-5 mm wide are necessary along two long sides of a printed circuit board or along long sides of a group printed circuit board;
3. Two fiducial marks on a printed circuit board in the form of round (preferably) areas with a diameter of 3,5-4 mm, hidden from the mask and situated in the opposite corners of a board (bias)are necessary for the right orientation of printer’s vision system and element placer. All the elements of a printed circuit boards must be not closer than 5 mm from the centre of fiducials;
4. In case of elements with lead pitch less than 0,5 mm it’s recommended to use two bias fiducial marks for precise element positioning;
5. Solder mask between element pads, on the conductors, between pads and via-holes, etc are necessary;
6. It is necessary to provide detailed specifications regarding assembly realization, assembly drawing and special requirements to assemble in case there are any;
7. Kitting should be in a standard factory package:
- rolls 8, 12, 16, 24 mm (In case the roll was already used it should have a tape trailer free of components not less than 20 cm);
- tapes that consist of several separate parts are not suitable for assembly;
- lines with length of up to 32 mm.;
- trays for microchips;
- tapes should include 2-5% spare of chip-components (10 items minimum) and 1% spare of microchips (2 items minimum) in case of loss and screening in the course of assembly;
- rolls 8, 12, 16, 24 mm (In case the roll was already used it should have a tape trailer free of components not less than 20 cm);
- tapes that consist of several separate parts are not suitable for assembly;
- lines with length of up to 32 mm.;
- trays for microchips;
- tapes should include 2-5% spare of chip-components (10 items minimum) and 1% spare of microchips (2 items minimum) in case of loss and screening in the course of assembly;
8. The following information should be provided on each component:
-resistors — rating, access, type and size of elements, the type of pin covering;
-capacitors — rating, access, type and size of elements, the type of pin covering;
-microchips — name, temperature range, the type of package, pin diameter (BGA), pitch, type of pin covering, dimensions;
-resistors — rating, access, type and size of elements, the type of pin covering;
-capacitors — rating, access, type and size of elements, the type of pin covering;
-microchips — name, temperature range, the type of package, pin diameter (BGA), pitch, type of pin covering, dimensions;
9. You have to provide a file in the P-CAD format 2002 which is necessary to make a stencil that will help to produce printed circuit boards or group printed circuit boards.
Manual assembly of DIP and SMD components
In case of single items assembly, small lots and pilot lots, complete cycle doesn’t seem to be worthwhile from technical and economic point of view. Moreover manual assembly is necessary in case of technology of compound assembly which is used in 100% of electronic engineering products. Our company offers high quality manual assembly with the help of special-purpose equipment, up-to-date technological materials and highly qualified specialists.
Main features of manual assembly section
· Assembly is realized using materials of the leading world vendors (MULTICORE, COBAR, RADIEL FONDAM)
· Work places are equipped with PACE and WELLER solder stations
· Working clothes is provided for assembly workers
· Rooms and work places correspond to the requirements of antistatic protection
When the process of soldering is ended all the printed circuit boards undergo obligatory automatic optical inspection.
Printed circuit board repairing
FINETECH repair-solder station (RSS), Germany — is a precise, practical and at the same time portable complex device for prototyping, repairing, maintenance and manufacturing of small range of products and for repairing in the sphere of high quality equipment. RSS allows:
· components unsoldering (disassembling)
· removal of used soldering paste
· cooling soldering connections
· using soldering pastes and glues
· picking, positioning, and placement of components
· BGA microchips soldering
· recovery of BGA ball pins
Calculation of repair cost
Calculation of repair cost depends on the amount of used elements, type of element package, quantity of pins, active storage (paste, glue).
Siemens representatives personally controlled production arrangement and operators training. At this moment Siemens specialists continue to give consultations and realize training programs that raise the level of qualification of SVJAZINFORMSERVICE GmbH specialists.
The overall performance of a line is 58 500 comp./hour. with the possibility of automatic two-side surface mounting and components soldering with type and size of elements starting from 0201 to chips with 0,4 mm pin pitch including BGA, TQFP, TSSOP.
All that high class cutting-edge equipment under the control of qualified specialists trained at one of the factories in Germany and having all the relevant certificates turns into a powerful instrument that allows realizing of high quality and defect-free assembly of thousands of printed circuit boards from third-party customers.
